Nomoro ea mohlala | Sephetho se ripple | Ponahatso ea hajoale | Volt ponts'o e nepahetseng | CC/CV Ho nepahala | Ramp-up le ramp-down | Ho thunya hofeta |
GKD45-2000CVC | VPP≤0.5% | ≤10mA | ≤10mV | ≤10mA/10mV | 0~99S | No |
Ts'ebetsong ea tlhahiso ea PCB, ho roala ka koporo ka electroless ke mohato oa bohlokoa. E sebelisoa haholo lits'ebetsong tse peli tse latelang. E 'ngoe e ntse e roala holim'a laminate e se nang letho' me e 'ngoe e ntse e phunyeletsa ka lesoba, hobane tlas'a maemo ana a mabeli, electroplating e ke ke ea etsoa kapa ha e khone ho etsoa. Nakong ea ho rala holim'a laminate e se nang letho, lipoleiti tsa koporo tse se nang electroless lesela le tšesaane la koporo holim'a substrate e se nang letho ho etsa hore substrate e tsamaisane le electroplating e eketsehileng. Ha ho etsoa plating ka sekoting, ho sebelisoa koporo e se nang electroless ho etsa marako a ka hare a sekoti se tsamaisang ho hokahanya lipotoloho tse hatisitsoeng ka mekhahlelo e fapaneng kapa lithakhisa tsa li-chips tse kopantsoeng.
Molao-motheo oa ho beha koporo ka electroless ke ho sebelisa karabelo ea lik'hemik'hale pakeng tsa ntho e fokotsang le letsoai la koporo ka har'a motsoako oa metsi e le hore ion ea koporo e ka fokotsoa ho athomo ea koporo. Karabelo e lokela ho ba e tsoelang pele e le hore koporo e lekaneng e ka etsa filimi 'me e koahele substrate.
Letoto lena la rectifier le etselitsoe ka ho khetheha PCB Naked layer copper plating, ho amohela boholo bo nyane ho ntlafatsa sebaka sa ho kenya, boemo bo tlase le bo phahameng bo ka laoloa ka ho chencha ka boiketsetso, pholile ea moea e sebelisoang ka duct e ikemetseng e kentsoeng ea moea, tokiso ea synchronous le ho boloka matla, likarolo tsena li netefatsa ho nepahala ho phahameng, ts'ebetso e tsitsitseng le ho tšepahala.
(U ka boela ua kena 'me ua tlatsa ka bohona.)